Progress in the developments of (Ba,Sr)TiO3 (BST) thin films for Gigabit era DRAMs

被引:292
|
作者
Ezhilvalavan, S
Tseng, TY
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 300, Taiwan
关键词
BST; thin films; dielectrics; DRAM capacitors; leakage current density; dielectric constant; reliability;
D O I
10.1016/S0254-0584(00)00253-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper reviews the recent developments of (Ba,Sr)TiO3 (BST) thin films for future Gbit era dynamic random access memory (DRAM) applications. The trends of DRAM capacitors in the last decade are briefly described first. Then the technological aspects of BST films such as deposition techniques, post-annealing, physical, electrical and dielectric characteristics of the films, effects of electrode materials, dielectric relaxation and defect analysis and the reliability phenomena associated with the films are briefly reviewed with specific examples from recent literature. The basic mechanisms that control the bulk electrical conduction and the origin of leakage currents in BST films are also discussed. Finally, possible developments of gigabit era DRAM technology are summarized. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:227 / 248
页数:22
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