Simulation of MEMS Capacitive ThermalSensor Based on Tip Deflection of a Functionally Graded Micro-beam

被引:0
作者
Ghadim, Mohammad Abbasgholipour [1 ]
Mailah, Musa [1 ]
Mohammadi-Alasti, Behzad
Ghadim, Mehdi Abbasgholipour
机构
[1] Univ Teknol Malaysia, Dept Appl Mech & Design, Fac Mech Engn, Skudai 81310, Johor, Malaysia
来源
MATERIALS, INDUSTRIAL, AND MANUFACTURING ENGINEERING RESEARCH ADVANCES 1.1 | 2014年 / 845卷
关键词
Micro Electro Mechanical Systems; Functionally Graded Micro-beam; Thermal Sensor; Tip Deflection; Capacitance; BEHAVIOR;
D O I
10.4028/www.scientific.net/AMR.845.340
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work presents a simulation study on a novel micro thermal sensor to evaluate a different range of temperature. Micro Electro Mechanical Systems (MEMS) technology is an interesting field in mechanics andmetrology. In this work, a capacitive micro thermal sensor based on tip deflection of Functionally Graded Micro-beam (FGM) was designed. The thermo-electric mechanical equations based on Euler-Bernoulli beam theory were derived and solved using step-by-step linearization method. The increase in temperature was expressed with respect to the changes in the capacitance. The beam deflections were compared with the existing results showing good conformity with the highest error obtained as 4.3% at 65 degrees C.
引用
收藏
页码:340 / 344
页数:5
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