Electrochemical deposition and investigation on copper-tin coatings containing amorphous phase

It is shown in the present paper that simultaneous electrodeposition of copper and tin from fluorosilicate electrolyte developed by the authors forms an alloy based on the intermetallic compound Cu10Sn3. As well as this crystalline phase, the alloy contains similar to 10 at.-% tin in amorphous state. The result of the alloying is the formation of fine grained, dense coatings with grain sizes from 0.1 to 0.5 mu m, which are ten times smaller than grain sizes in copper films. In comparison with copper and commercial Cu-Sn alloys the obtained coatings have a better atmospheric corrosion resistance and solder ability.