Array Test Structure for Ultra-Thin Gate Oxide Degradation Issues

被引:1
|
作者
Hafkemeyer, Kristian M. [1 ]
Domdey, Andreas [1 ]
Schroeder, Dietmar [1 ]
Krautschneider, Wolfgang H. [1 ]
机构
[1] Tech Univ Hamburg, Inst Nanoelect, D-21073 Hamburg, Germany
来源
ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES | 2009年
关键词
D O I
10.1109/ICMTS.2009.4814616
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An array test structure for highly parallelized measurements of ultra-thin MOS gate oxide failures caused by degradation is presented. The test structure allows for voltage stress tests of several thousand NMOS devices under test (DUTs) in parallel to provide a large and significant statistical base regarding soft as well as hard breakdown and stress induced degradation of transistor parameters. The array has been fabricated in a standard 130 nm CMOS technology. As mixed mode technologies provide both thin and thick oxide MOS transistors, different gate oxide thicknesses have been chosen for DUTs and digital control logic which gives the possibility to stress the DUTs with high gate voltages.
引用
收藏
页码:85 / 90
页数:6
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