Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs

被引:51
作者
Chen, Cheng [1 ,2 ]
Labrousse, Denis [1 ]
Lefebvre, Stephane [1 ]
Petit, Mickael [1 ]
Buttay, Cyril [2 ]
Morel, Herve [2 ]
机构
[1] ENS Cachan, CNRS, SATIE CNAM, F-94234 Cachan, France
[2] INSA Lyon, Ampere, F-69621 Villeurbanne, France
关键词
SiC; MOSFET; BJT; Short circuit; PERFORMANCE; DEVICES; JFET;
D O I
10.1016/j.microrel.2015.06.097
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents experimental robustness tests made on Silicon Carbide (SiC) MOSFETs and SiC Bipolar Junction Transistors (BJTs) submitted to short-circuit operations (SC) or current limitation modes. For SiC MOSFETs, a gate leakage current is detected before failure without being responsible for the immediate failure. Nevertheless this gate leakage Current is not without effect on the integrity of the SiC MOSFETs. Based on several robustness tests performed on SiC MOSFETs and on the comparison with experimental results obtained with SiC BJTs, the paper points out two main failure modes for SiC MOSFETs. The first one results in a simultaneously short circuit between drain and gate and drain and source and the second one in a degradation of the insulation between gate and source leading to a short circuit between gate and source. For some tested devices, the failure appears in a very interesting open state mode between drain and source after physical short-circuit between gate and source with a mode of failure very similar to those observed for SiC BIT. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1708 / 1713
页数:6
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