Soft breakdown current noise in ultra-thin gate oxides

被引:15
|
作者
Cester, A
Bandiera, L
Ghidini, G
Bloom, I
Paccagnella, A
机构
[1] Univ Padua, Dipartimento Elettron & Informat, I-35131 Padua, Italy
[2] Ist Nazl Fis Mat, Unita Padova, I-35131 Padua, Italy
[3] ST Microelect, I-20041 Agrate Brianza, Italy
[4] Saifun Semicond Ltd, Netanya, Israel
关键词
integrated circuit reliability; MOS devices; semiconductor devices reliability; silicon material devices; soft breakdown; constant current stress;
D O I
10.1016/S0038-1101(02)00036-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work we studied the soft breakdown (SB) in ultra-thin gate oxides (<3 nm) subjected to constant current stress. SB current derives from the superposition of several random telegraph signals noises with different time constants and amplitudes. Such fluctuations derive from the conductance modulation of a damaged region inside the oxide layer, due to the electrical stress. We found that the current noise power density follows the 1/f(2) power law (with alpha between 1 and 2) over a wide range of frequency (1 Hz-100 kHz). Only at frequency smaller than 1-10 Hz a possible deviation from this low cannot be excluded. Moreover, the discrete fluctuations typical of SB are statistically independent events at least over time periods around hundreds of seconds, according to a Poisson process. This result suggest that electron trapping/detrapping in defect sites near or inside the SB conductive path can be claimed as responsible for such conductance modulation. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1019 / 1025
页数:7
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