9.4-W/mm power density,AlGaN-GaN HEMTs on free-standing GaN substrates

被引:78
作者
Chu, KK [1 ]
Chao, PC
Pizzella, MT
Actis, R
Meharry, DE
Nichols, KB
Vaudo, RP
Xu, X
Flynn, JS
Dion, J
Brandes, GR
机构
[1] BAE Syst, Informat & Elect Warfare Syst, Nashua, NH 03060 USA
[2] Cree Inc, Danbury, CT 06810 USA
关键词
Free-standing; GaN substrate; high electron-mobility transistor (HEMT); microwave power;
D O I
10.1109/LED.2004.833847
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High power microwave AlGaN-GaN high electron-mobility transistors, (HEMTs) on free-standing GaN substrates are demonstrated for the first time. Measured gate leakage was -2.2 muA/mm at -20 V and -10 muA/mm at -45 V gate bias. When operated at a drain bias of 50 V, devices showed a record continuous-wave output power density of 9.4 W/mm at 10 GHz with an associated power-added efficiency of 40%. Long-term stability of device RF operation was also examined. Under room conditions, devices driven at 25 V and 3-dB gain compression remained stable in 200 It, degrading only by 0.18 dB in output power. Such results illustrate the potential of GaN substrate technology in supporting reliable, high performance AlGaN-GaN HEMTs for microwave power applications.
引用
收藏
页码:596 / 598
页数:3
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