Microstructure and mechanical properties of bulk nanostructured Cu-Ta alloys consolidated by equal channel angular extrusion

被引:111
作者
Darling, K. A. [1 ]
Tschopp, M. A. [1 ]
Guduru, R. K. [2 ]
Yin, W. H. [3 ]
Wei, Q. [3 ]
Kecskes, L. J. [1 ]
机构
[1] US Army Res Lab, Weap & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
[2] Univ Michigan, Dept Mech Engn, Dearborn, MI 48128 USA
[3] Univ N Carolina, Dept Mech Engn & Engn Sci, Charlotte, NC 28223 USA
关键词
Nanocrystalline alloys; Cu-Ta alloys; Equal channel angular pressing; Mechanical behavior; Dynamic compression test; STRAIN-RATE SENSITIVITY; SHEAR PUNCH TEST; NANOCRYSTALLINE COPPER; GRAIN-SIZE; PLASTIC-DEFORMATION; THERMAL-STABILITY; ACTIVATION VOLUME; TENSILE BEHAVIOR; ULTRAFINE GRAIN; METALS;
D O I
10.1016/j.actamat.2014.04.074
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Nanostructured Cu-Ta alloys have shown promise as high-strength nanocrystalline materials in part due to their limited grain growth at high temperatures. In the present study, Cu-Ta alloy powders, synthesized via high-energy cryogenic mechanical alloying, were consolidated into bulk nanostructured specimens using equal channel angular extrusion (ECAE) at high temperatures. Subsequent microstructure characterization indicated full consolidation, which resulted in an equiaxed grain structure for the Cu matrix along with the formation of fine Ta precipitates, the size distributions of which varied both with composition and processing temperature. Microhardness, compression and shear punch testing indicated, in some cases, an almost threefold increase in mechanical properties above that predicted by Hall-Petch estimates for pure nanocrystalline Cu. Stress relaxation tests substantiated the strain-hardening behavior and grain-size-dependent dislocation activity observed in the nanocrystalline Cu-Ta samples. Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
引用
收藏
页码:168 / 185
页数:18
相关论文
共 78 条
  • [21] Stabilization and strengthening of nanocrystalline copper by alloying with tantalum
    Frolov, T.
    Darling, K. A.
    Kecskes, L. J.
    Mishin, Y.
    [J]. ACTA MATERIALIA, 2012, 60 (05) : 2158 - 2168
  • [22] Analytical and computational description of effect of grain size on yield stress of metals
    Fu, HH
    Benson, DJ
    Meyers, MA
    [J]. ACTA MATERIALIA, 2001, 49 (13) : 2567 - 2582
  • [23] Review: Processing of metals by equal-channel angular pressing
    Furukawa, M
    Horita, Z
    Nemoto, M
    Langdon, TG
    [J]. JOURNAL OF MATERIALS SCIENCE, 2001, 36 (12) : 2835 - 2843
  • [24] DISSIPATION IN ADIABATIC SHEAR BANDS
    GRADY, DE
    [J]. MECHANICS OF MATERIALS, 1994, 17 (2-3) : 289 - 293
  • [25] PROPERTIES OF AN ADIABATIC SHEAR-BAND PROCESS ZONE
    GRADY, DE
    [J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 1992, 40 (06) : 1197 - 1215
  • [26] Determination of activation volume in nanocrystalline Cu using the shear punch test
    Guduru, R. K.
    Wong, P. Z.
    Darling, K. A.
    Koch, C. C.
    Murty, K. L.
    Scattergood, R. O.
    [J]. ADVANCED ENGINEERING MATERIALS, 2007, 9 (10) : 855 - 859
  • [27] Finite element analysis of a shear punch test
    Guduru, R. K.
    Nagasekhar, A. V.
    Scattergood, R. O.
    Koch, C. C.
    Murty, K. L.
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2006, 37A (05): : 1477 - 1483
  • [28] Mechanical behavior of nanocrys.talline copper
    Guduru, Ramesh K.
    Murty, K. Linga
    Youssef, Khaled M.
    Scattergood, Ronald O.
    Koch, Carl C.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 463 (1-2): : 14 - 21
  • [29] Mechanical properties of electrodeposited nanocrystalline copper using tensile and shear punch tests
    Guduru, Ramesh Kumar
    Darling, Kristopher A.
    Scattergood, Ronald O.
    Koch, Carl C.
    Murty, K. L.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2007, 42 (14) : 5581 - 5588
  • [30] Mechanical properties of nanocrystalline Fe-Pb and Fe-Al2O3
    Guduru, RK
    Scattergood, RO
    Koch, CC
    Murty, KL
    Guruswamy, S
    McCarter, MK
    [J]. SCRIPTA MATERIALIA, 2006, 54 (11) : 1879 - 1883