Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate

被引：29

作者：

Sebo, Pavol ^{[1
]}

Moser, Zbigniew ^{[2
]}

Svec, Peter ^{[3
]}

Janickovic, Dusan ^{[3
]}

Dobrocka, Edmund ^{[4
]}

Gasior, Wladyslaw ^{[2
]}

Pstrus, Janus ^{[2
]}

机构：

[1] Slovak Acad Sci, Inst Mat & Machine Mech, Bratislava 83102 3, Slovakia

[2] Polish Acad Sci, Inst Met & Mat Sci, PL-30059 Krakow, Poland

[3] Slovak Acad Sci, Inst Phys, Bratislava 84511 45, Slovakia

[4] Slovak Acad Sci, Electrotech Inst, Bratislava 84104 45, Slovakia

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 480卷 / 02期

关键词：

Lead-free solders; Copper; Interaction; X-ray scan; Phase analysis; LEAD-FREE SOLDERS; GROWTH-KINETICS; SN-AG; IDENTIFICATION; COPPER; JOINTS;

D O I：

10.1016/j.jallcom.2009.02.110

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Influence of indium in Sn3.13Ag0.74Cu solder containing 4, 15, 30, 50 and 75 at.% In on the microstructure at the solder/Cu interface after wetting at 523 K for 1800 s was studied. The scanning electron microscopy (SEM) combined with energy-dispersive X-ray spectroscopy (EDX), standard and spatially resolved X-ray diffraction (XRD) techniques were used to determine the phases present at the solder/Cu interface. It was found that for In concentration up to 30 at.% the interface is formed by Cu(6)Sn(5) phase. For higher In content (50 and 75 at.% In) interface consists of copper rich Cu(41)Sn(11) phase. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：409 / 415

页数：7

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