Tantalum nitride/copper nanocomposite with zero temperature coefficient of resistance

被引：29

作者：

Fu, B. ^{[1
]}

Gao, L. ^{[1
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China

来源：

SCRIPTA MATERIALIA | 2006年 / 55卷 / 06期

基金：

中国国家自然科学基金;

关键词：

nanocrystalline materials; nitrides; composites; electrical properties;

D O I：

10.1016/j.scriptamat.2006.05.031

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We report the design of a new nanocomposite exhibiting a zero temperature coefficient of resistivity, which are composed of tantalum nitride and copper nanoparticles. With the increase in copper content, the temperature coefficient of resistivity of the TaN-Cu nanocomposites changed from negative to positive values and achieved zero value at 37.5 at.% copper. The micrograph showed that the nanocomposites can be described as nano/nano type (two nanophases) ceramic. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：521 / 524

页数：4

共 24 条

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