High-temperature bonding performance of modified heat-resistant adhesive for ceramic connection

A modified polymer adhesive characterized by "one-time connection at low-temperature without post-treatment" was developed for joining mullite ceramic. Without pre-calcination, the bonding strength of cured adhesive maintained above 6.5 MPa during the whole heating process and even reached 24.8 MPa at 1300 degrees C. After pre-calcination at 1300 degrees C, the adhesive obtained the optimum bonding performance as much more heat-resistant ceramics and high-temperature melting glass generated in adhesive. Its bonding strength kept about 45 MPa during test from RT to 700 degrees C, while the value decreased to 28.5 MPa at 1300 degrees C because of the melting of newly-formed glass. With increasing thermal-cycling times at 1300 degrees C, the value could maintain at about 35.2 MPa. (C) 2015 Elsevier B.V. All rights reserved.