共 18 条
[1]
Chip-to-chip optoelectronics SOP on organic boards packages
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2004, 27 (02)
:386-397
[2]
Cho HS, 2005, IEEE T ADV PACKAGING, V28, P114, DOI 10.1109/TADVP.2004.842291
[3]
160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC
[J].
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS,
2007,
:1256-+
[4]
Optically interconnected electronic chips: a tutorial and review of the technology
[J].
ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL,
2001, 13 (05)
:221-232
[5]
Glebov A. L., 2005, 2005 Conference on Lasers and Electro-Optics Europe (IEEE Cat. No. 05TH8795)
[7]
A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2001, 24 (03)
:375-383
[8]
*HFAN, HFAN300
[10]
Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects
[J].
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,
2005, 28 (04)
:304-311