Total-ionizing-dose effects in modern CMOS technologies

被引:522
作者
Barnaby, H. J. [1 ]
机构
[1] Arizona State Univ, Tempe, AZ 85287 USA
关键词
1/f noise; high-k; interface traps; oxide trapped charge; radiation; RILC; shallow trench isolation; silicon-on-insulation (SOI); total ionizing dose;
D O I
10.1109/TNS.2006.885952
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This review paper discusses several key issues associated with deep submicron CMOS devices as well as advanced semiconductor materials in ionizing radiation environments. There are, as outlined in the ITRS roadmap, numerous challenges ahead or commercial industry in its effort to track Moore's Law down to the 45 nm node and beyond. While many of the classical threats posed by ionizing radiation exposure have diminished by aggressive semiconductor scaling, the question remains whether there may be unknown, potentially worse threats lurking in the deep submicron regime. This manuscript provides a basic overview of some of the materials, devices, and designs that are being explored or, in some cases, used today. An overview of radiation threats and how radiation effects can be characterized is also presented. Last, the paper provides a detailed discussion of what we know now about how modern devices and materials respond to radiation. and how we may assess, through the use of advanced analysis and modeling techniques, the relative hardness of future technologies.
引用
收藏
页码:3103 / 3121
页数:19
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