Impact of the Packaging Technology on a SiGe:C Ku-Band Low Noise Converter for Satellite Reception

被引：0

作者：

Gamand, Patrice ^{[1
]}

Tesson, Olivier ^{[1
]}

机构：

[1] NXP Semicond, F-14906 Caen 9, France

来源：

2013 EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2013年

关键词：

Low-Noise Block (LNB); packaging; co-design; microwave; BiCMOS technology;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper demonstrates the benefits of co-designing microwave IC's in advanced Fan-Out-Package. This concept has been employed on a fully integrated Low Noise Receiver for Satellite TV application realized in a SiGe:C BiCMOS technology. Matching, attenuation, conversion gain, coupling and noise figure (NF) characteristics of the full packaged circuit are strongly improved with respect to conventional solution based on HVQFN packages. In particular, by using a co-design package-circuit methodology we have been able to reduce the overall noise figure of the down-converter by 2.5 dB in the Ku-band frequency range. The complete product exhibits 6 dB of NF associating with 46 dB of gain. The phase noise is as low as -117 dBc/Hz at 10 MHz offset from the LO frequency of 10.6 GHz. This approach clearly outperforms down-bond based solutions in conventional plastic package and should definitely be considered for high performance low cost microwave and millimeter wave applications.

引用

页码：219 / 222

页数：4