ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

被引：11

作者：

Liao, Bokai ^{[1
]}

Jia, Wenfeng ^{[2
]}

Sun, Ruiyan ^{[3
]}

Chen, Zhenyu ^{[1
]}

Guo, Xingpeng ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Chem & Chem Engn, Hubei Key Lab Mat Chem & Serv Failure, Wuhan 430074, Hubei, Peoples R China

[2] Sinopec Res Inst Petr Engn, Beijing 100101, Peoples R China

[3] Jilin Oilfield, Survey & Design Inst, Songyuan 138001, Peoples R China

来源：

SURFACE REVIEW AND LETTERS | 2019年 / 26卷 / 06期

基金：

中国国家自然科学基金;

关键词：

Solder alloy; corrosion; electrochemical migration; dendrite; SN SOLDER; TIN; MECHANISM; NACL; LIFETIMES;

D O I：

10.1142/S0218625X18502086

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200 mu m. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

引用

页数：7

共 30 条

[1]

Ambat R., 2017, 40 INT SPRING SEM, P1

[2] Growth of electrolytic copper dendrites. II: Oxalic acid medium [J].

Devos, O. ;

Gabrielli, C. ;

Beitone, L. ;

Mace, C. ;

Ostermann, E. ;

Perrot, H. .

JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2007, 606 (02) :85-94

[3] Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn-6.5Zn alloy [J].

El-Daly, A. A. ;

Hammad, A. E. ;

Al-Ganainy, G. S. ;

Ibrahiem, A. A. .

MATERIALS & DESIGN, 2014, 56 :594-603

[4] ELECTROCHEMICAL MECHANISM OF ATMOSPHERIC RUSTING [J].

EVANS, UR .

NATURE, 1965, 206 (4988) :980-&

[5] A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions [J].

Herkommer, Dominik ;

Punch, Jeff ;

Reid, Michael .

MICROELECTRONICS RELIABILITY, 2010, 50 (01) :116-126

[6] Effect of 9 wt.% in addition to Sn0.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads [J].

Islam, MN ;

Chan, YC ;

Sharif, A ;

Rizvi, MJ .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 396 (1-2) :217-223

[7] Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions [J].

Jung, Ja-Young ;

Lee, Shin-Bok ;

Joo, Young-Chang ;

Lee, Ho-Young ;

Park, Young-Bae .

MICROELECTRONIC ENGINEERING, 2008, 85 (07) :1597-1602

[8] Effect of ionization characteristics on electrochemical migration lifetimes of Sn-3.0Ag-0.5Cu solder in NaCl and Na2SO4 solutions [J].

Jung, Ja-Young ;

Lee, Shin-Bok ;

Lee, Ho-Young ;

Joo, Young-Chang ;

Park, Young-Bae .

JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (08) :1111-1118

[9] Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board [J].

Lee, SB ;

Yoo, YR ;

Jung, JY ;

Park, YB ;

Kim, YS ;

Joo, YC .

THIN SOLID FILMS, 2006, 504 (1-2) :294-297

[10] Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions [J].

Liao, Bokai ;

Chen, Zhenyu ;

Qiu, Qubing ;

Guo, Xingpeng .

CORROSION SCIENCE, 2017, 118 :190-201

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