Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints

被引：29

作者：

Darbandi, Payam ^{[1
]}

Lee, Tae-kyu ^{[2
]}

Bieler, Thomas R. ^{[1
]}

Pourboghrat, Farhang ^{[1
]}

机构：

[1] Michigan State Univ, E Lansing, MI 48824 USA

[2] Cisco Syst Inc, San Jose, CA USA

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2014年 / 85卷

基金：

美国国家科学基金会;

关键词：

Finite element analysis; Lead-Free solder; Crystal plasticity; Electron backscattering diffraction (EBSD); Plastic shear deformation; ORIENTATION; ANISOTROPY; TIN; SN;

D O I：

10.1016/j.commatsci.2014.01.002

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The anisotropy of the tin phase in a Pb-free tin based solder joint has a significant effect on heterogeneous deformation and therefore, the reliability of solder joints. In this study the ability of crystal plasticity finite element (CPFE) modeling to account for elastic and plastic anisotropy in tin based solder joints was examined using shear deformation applied on a simplified representation of a real microstructure of four specific SAC305 solder balls. Commonly observed microstructures in lead free solders are either single crystals or a particular microstructure with solidification twin relationship with about 55-65 degrees rotations about a common [100] axis (known as beach-ball microstructure [6]). In this study two different single crystals and two different beach-ball microstructures were investigated using CPFE modeling. Simulation results show the ability of CPFE to predict the heterogeneous deformation due to the anisotropic elastic and plastic properties of tin in lead free solder joints. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：236 / 243

页数：8

共 20 条

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