Laser processing of flexible substrates

被引：0

作者：

Gordon, P ^{[1
]}

Berenyi, R ^{[1
]}

Nyitrai, Z ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, H-1111 Budapest, Hungary

来源：

POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS | 2002年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The paper will describe some results of the research project that aimed at the application of CO2 and frequency multiplied Nd:YAG lasers for drilling via holes into copper clad flexible laminates of polyimide and polyester based materials. We have also carried out experiments for removing the insulation layer from the copper foil to open windows, i.e. to get clean copper areas. This can be a key process in the production of TABS. Three wavelengths (10600 nm, 1064 nm and 355 nm) were used to find the optimal process parameters for drilling and layer removing. The samples were examined and evaluated many ways to conclude the general behaviour of the material and its interaction with different laser beam.

引用

页码：183 / 187

页数：5

共 6 条

[1] BELFORTE DA, ARCH AUGUST 1998 BAC
[2] GORDON P, 1999, 22 ISSE FREIT DRESD
[3] HACKIEWICZ H, 2002, 25 INT SPRING SEM EL, P294
[4] Laser processing of adhesives and polymeric materials for microelectronics packaging applications
Illyefalvi-Vitéz, Z
[J]. 4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 289 - 295
[5] Laser processing for microelectronics packaging applications
Illyefalvi-Vitéz, Z
[J]. MICROELECTRONICS RELIABILITY, 2001, 41 (04) : 563 - 570
[6] LERNER EJ, 1998, LASER FOCUS WORL SEP, P131

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