Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder

被引：105

作者：

Xia, ZD ^{[1
]}

Chen, ZG ^{[1
]}

Shi, YW ^{[1
]}

Mu, N ^{[1
]}

Sun, N ^{[1
]}

机构：

[1] Beijing Polytech Univ, Key Lab Adv Funct Mat, Minist Educ China, Sch Mat Sci & Engn, Beijing 100022, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 06期

关键词：

rare earth additions; Sn-Ag-Bi solder; dispersion strengthening; Pb-free solder;

D O I：

10.1007/s11664-002-0126-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

There are numerous intermetallic compounds (IMCs) with various shapes in a tin-silver-bismuth solder alloy. These IMCs can affect the mechanical properties of the solder and, therefore, the reliability of the joints. In this study, minimal rare earth elements added into the solder were adsorbed at the grain boundary of IMCs. This adsorption behavior changed the relationship between growth velocities of the various crystalline directions of the IMC polycrystalline, which resulted in finer particles and more uniform distribution of the IMC phase. The average size of IMC particles decreased from 0.20 mum to 0.12 mum, while their average distance decreased from 1.25 mum to 0.65 mum. These fine IMC particles made the alloy stronger and more ductile through dispersion strengthening.

引用

页码：564 / 567

页数：4

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