Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In

被引：10

作者：

Kaban, I. ^{[1
]}

Khalouk, K. ^{[2
]}

Koehler, M. ^{[3
]}

Hoyer, W. ^{[1
]}

Gasser, J. -G. ^{[2
]}

机构：

[1] Tech Univ Chemnitz, Inst Phys, D-09107 Chemnitz, Germany

[2] Univ Paul Verlaine Metz, LPMD, F-57078 Metz 3, France

[3] German Aerosp Ctr DLR, Inst Mat Phys Space, D-51147 Cologne, Germany

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 01期

关键词：

Lead-free solders; density; resistivity; surface tension; wetting; SURFACE-TENSION; TRANSPORT-PROPERTIES; CONTACT-ANGLE;

D O I：

10.1007/s11664-009-0952-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The melting temperature, electrical resistivity, surface tension, and density of the (Sn0.965Ag0.035)(95.17)Bi-4.83, (Sn0.965Ag0.035)(95.17)Bi4.73Ge0.1, and (Sn0.965Ag0.035)(94)-Bi2In4 alloys have been studied in comparison with the Sn60Pb40 and Sn96.5Ag3.5 binary alloys (all wt.%). The electrical conductivity of the solid alloys based on Sn96.5Ag3.5 is comparable to that of the Sn60Pb40 alloy. The wetting behavior on Cu and Ni surfaces has been investigated in a wide temperature interval. It is established that the addition of Bi to Sn96.5Ag3.5 decreases the surface tension and improves the wetting properties of the alloy. The addition of a small quantity of Ge to the Sn-Ag-Bi alloy did not improve the wetting behavior on either Cu or Ni surfaces. The wetting ability of the (Sn0.965Ag0.035)(94)Bi2In4 alloy was slightly worse as compared with (Sn0.965Ag0.035)(95.17)Bi-4.83.

引用

页码：70 / 76

页数：7

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