Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder

被引：42

作者：

Wang, Yong ^{[1
,2
]}

Zhao, Xiuchen ^{[1
]}

Xie, Xiaochen ^{[2
]}

Gu, Yue ^{[1
]}

Liu, Ying ^{[1
]}

机构：

[1] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100076, Peoples R China

[2] Beijing Microelect Technol Inst, Beijing 100076, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2015年 / 26卷 / 12期

关键词：

INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; COMPOSITE SOLDERS; FATIGUE LIFE;

D O I：

10.1007/s10854-015-3151-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In the present study, the nano-composite solder with SiO2 nanoparticles into eutectic Sn3.0Ag0.5Cu solder were prepared. The addition concentration of SiO2 nanoparticles ranges from 0 to 1 wt%. The effects of SiO2 on the microstructure, the wettability, joint shear force of the composite solder under different working temperature and the growth of interfacial intermetallics compounds (IMCs) at solder/Cu substrate during thermal cycling were investigated respectively. The results show that appropriate addition of nano-SiO2 particles can refine the beta-Sn matrixes and enhance the wettability of nano-SiO2 composite solder. Additionally, slight addition of nano-SiO2 particles can inhibit the formation and the growth of the interfacial IMCs layer between the solder and Cu substrate during reflow and thermal cycling. Moreover, nano-SiO2 can also increase the shear force of composite solder joint. However, excessive addition of SiO2 nanoparticles in the Sn3.0Ag0.5Cu solders degrade the wettability, joint shear force and the inhibition effect on the interfacial IMCs. There is an optimum addition concentration of SiO2 nanoparticles in Sn3.0Ag0.5Cu solder alloys, which is 0.05 wt%, and Sn3.0Ag0.5Cu-0.05 wt% SiO2 solders possess the biggest wetting force, highest shear force and the best inhibition effect on the interfacial IMCs formation and growth.

引用

页码：9387 / 9395

页数：9

共 19 条

[1]

Callister W D., 2018, Materials Science and Engineering: An Introduction, V10th edn

[2] The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction [J].

Chang, S. Y. ;

Tsao, L. C. ;

Wu, M. W. ;

Chen, C. W. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (01) :100-107

[3] Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints [J].

Che, F. X. ;

Pang, John H. L. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2012, 541 :6-13

[4] Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder [J].

Chuang, T. H. ;

Wu, M. W. ;

Chang, S. Y. ;

Ping, S. F. ;

Tsao, L. C. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (08) :1021-1027

[5] Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect [J].

Dutta, I ;

Majumdar, BS ;

Pan, D ;

Horton, WS ;

Wright, W ;

Wang, ZX .

JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) :258-270

[6] Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance [J].

El-Daly, A. A. ;

Fawzy, A. ;

Mansour, S. F. ;

Younis, M. J. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 578 :62-71

[7] Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates [J].

Gain, Asit Kumar ;

Chan, Y. C. ;

Yung, Winco K. C. .

MICROELECTRONICS RELIABILITY, 2011, 51 (05) :975-984

[8] High-temperature shear strength of lead-free Sn-Sb-Ag/Al2O3 composite solder [J].

Geranmayeh, A. R. ;

Mahmudi, R. ;

Kangooie, M. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (12) :3967-3972

[9] Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates [J].

Gu, Yue ;

Zhao, Xiuchen ;

Li, Yi ;

Liu, Ying ;

Wang, Yong ;

Li, Zhenyu .

JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 627 :39-47

[10] Extending the fatigue life of Pb-free SAC solder joints under thermal cycling [J].

Ishikawa, Shoho ;

Tohmyoh, Hironori ;

Watanabe, Satoshi ;

Nishimura, Tomonori ;

Nakano, Yoshikatsu .

MICROELECTRONICS RELIABILITY, 2013, 53 (05) :741-747

← 1 2 →