Elementary Surface Chemistry during CuO/Al Nanolaminate-Thermite Synthesis: Copper and Oxygen Deposition on Aluminum (111) Surfaces

被引:48
作者
Lanthony, Cloe [1 ,2 ]
Guiltat, Mathilde [1 ,2 ]
Ducere, Jean Marie [1 ,3 ]
Verdier, Agnes [1 ,3 ]
Hemeryck, Anne [1 ,3 ]
Djafari-Rouhani, Mehdi [1 ,2 ]
Rossi, Carole [1 ,3 ]
Chabal, Yves J. [4 ]
Esteve, Alain [1 ,3 ]
机构
[1] CNRS, Lab Anal & Architecture Syst, F-31400 Toulouse, France
[2] Univ Toulouse 3, Lab Anal & Architecture Syst, F-31400 Toulouse, France
[3] Univ Toulouse, Lab Anal & Architecture Syst, F-31400 Toulouse, France
[4] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA
基金
美国国家科学基金会;
关键词
Al/CuO nanolaminates; Al/CuO nanothermites; aluminum-oxidation; DFT calculations; Cu on Al(111); INITIO MOLECULAR-DYNAMICS; TOTAL-ENERGY CALCULATIONS; OXIDE FILMS; DISSOCIATIVE CHEMISORPTION; NANOENERGETIC MATERIALS; ELECTRONIC-STRUCTURE; GROWTH MODE; AL(111); O-2; MECHANISMS;
D O I
10.1021/am503126k
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The surface chemistry associated with the synthesis of energetic nanolaminates controls the formation of the critical interfacial layers that dominate the performances of nanothermites. For instance, the interaction of Al with CuO films or CuO with Al films needs to be understood to optimize Al/CuO nanolaminates. To that end, the chemical mechanisms occurring during early stages of molecular CuO adsorption onto crystalline Al(111) surfaces are investigated using density functional theory (DFT) calculations, leading to the systematic determination of their reaction enthalpies and associated activation energies. We show that CuO undergoes dissociative chemisorption on Al(111) surfaces, whereby the Cu and O atoms tend to separate from each other. Both Cu and O atoms form islands with different properties. Copper islanding fosters Cu insertion (via surface site exchange mechanism) into the subsurface, while oxygen islands remain stable at the surface. Above a critical local oxygen coverage, aluminum atoms are extracted from the Al surface, leading to oxygen-aluminum intermixing and the formation of aluminum oxide (?-alumina). For Cu and O co-deposition, copper promotes oxygen-aluminum interaction by oxygen segregation and separates the resulting oxide from the Al substrate by insertion into Al and stabilization below the oxide front, preventing full mixing of Al, Cu, and O species.
引用
收藏
页码:15086 / 15097
页数:12
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