Failure analysis techniques for a 3D world

被引：12

作者：

Henderson, Christopher L. ^{[1
]}

机构：

[1] Semitracks Inc, Albuquerque, NM 87111 USA

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2013.06.022

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The proliferation of advanced IC package configurations is driving the need for new tool failure analysis (FA) tool development. Although scientists and engineers in the semiconductor industry developed new tools and techniques based on Moore's Law, with its need to analyze ever-smaller devices, the advent of three-dimensional packaging schemes requires new tools. In this paper we quickly review the existing tools used for package-level FA and introduce several new techniques that aid with this type of analysis. We also discuss the problems and challenges moving forward for this type of tool development. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：1171 / 1178

页数：8

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