In-process measurement for cure depth control of nano stereolithography using evanescent light
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作者:
Takahashi, S.
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Univ Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, JapanUniv Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, Japan
Takahashi, S.
[1
]
Kong, D.
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Univ Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, JapanUniv Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, Japan
Kong, D.
[1
]
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Michihata, M.
[1
]
Takamasu, K.
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Univ Tokyo, Dept Precis Engn, Bunkyo Ku, Hongo 7-3-1, Tokyo 1138656, JapanUniv Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, Japan
Takamasu, K.
[2
]
机构:
[1] Univ Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Komaba 4-6-1, Tokyo 1538904, Japan
[2] Univ Tokyo, Dept Precis Engn, Bunkyo Ku, Hongo 7-3-1, Tokyo 1138656, Japan
One shot layer by layer microstereolithography using evanescent light is regarded as one of the potential methods to achieve a spatial process resolution of submicrometer, meeting a demand for the next-generation nano/micro 3D manufacturing. However, there is a critical problem that curing phenomena by evanescent light is too sensitive to detailed exposure condition such as temperature of photosensitive resin, dynamic diffusion of free radicals, dissolved oxygen, and so on. To solve this critical problem, we developed an in-process evaluation method for potential cured thickness by evanescent light and experimentally succeeded in cure depth control with a layer thickness of submicrometer during its curing process. (C) 2019 Published by Elsevier Ltd on behalf of CIRP.