Modelling of process formation of the nanocomposite TiN-Cu layers received by vacuum-arc evaporation of Ti and magnetron sputtering of Cu

被引：1
|
作者：
Tsyrenov, D. B-D [1 ]
Semenov, A. P. [1 ]
Smirnyagina, N. N. [1 ]
机构：
[1] RAS, Inst Phys Mat Sci SB, Sakhyanovoy 6, Ulan Ude 670047, Russia
来源：
5TH INTERNATIONAL CONGRESS ON ENERGY FLUXES AND RADIATION EFFECTS 2016 | 2017年 / 830卷
基金：
俄罗斯基础研究基金会;
关键词：
D O I：
10.1088/1742-6596/830/1/012091
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Modeling a TiN-Cu layers deposition process on a fused silica substrate under given conditions is carried out in this work. Calculation formulas which allow to determine the films thickness and their uniformity, with a substrate holder being located at an angle of 45 degrees to the normals of mutually perpendicular planes of the evaporated titanium cathode and the magnetron sputtering copper cathode, are given. The results of this work will be used to analyze the distribution velocity of the substance condensation flow and the character of the formed composite layers depending on the geometry of the cathode-substrate system.
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页数：6
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