Modeling, Simulation and Analysis of Coplanar Waveguide on Glass Substrate for 2.5D Integration

被引：0

作者：

Shang, Wenya ^{[1
,2
,3
]}

Pang, Cheng ^{[1
,3
]}

Ren, Xiaoli ^{[1
]}

Qin, Zheng ^{[1
,2
,3
]}

Yu, Daquan ^{[3
]}

Shangguan, Dongkai ^{[1
,3
]}

机构：

[1] Natl Ctr Adv Packaging, Wuxi 214135, Peoples R China

[2] Univ Chinese Acad Sci, Beijing 100029, Peoples R China

[3] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

Coplanar Waveguide (CPW); Glass Substrate; Finite Element Method; transmission characteristic;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Glass is an ideal material for 2.5D packaging application with excellent electrical, optical and mechanical properties. In this paper, several forms of coplanar waveguide (CPW) on glass substrate were modeled and simulated using 3D full-wave finite element method (FEM). The target of this research was to provide guidance for the design and analysis of CPW on glass substrate. Analyses of CPWs on different redistribution layers (RDLs) with various line lengths are presented. And the comparison of the performances of CPWs on silicon substrate and glass substrate are also described in this paper. The simulation results illustrate the electrical performances of CPWs on glass substrate are much better than on silicon substrate, especially in high frequency range.

引用

页码：564 / 567

页数：4