Compact thermal modeling for temperature-aware design

被引：0

作者：

Huang, W ^{[1
]}

Stan, MR ^{[1
]}

Skadrons, K ^{[1
]}

Sankaranarayanan, K ^{[1
]}

Ghosh, S ^{[1
]}

Velusamy, S ^{[1
]}

机构：

[1] Univ Virginia, Dept Elect & Comp Engn, Charlottesville, VA 22903 USA

来源：

41ST DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2004 | 2004年

关键词：

design; algorithms; temperature-aware design; temperature-aware computing; thermal model; power-aware design; leakage; reliability;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modem CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.

引用

页码：878 / 883

页数：6

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