Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

被引：10

作者：

Chou, Tzu-Chieh ^{[1
]}

Yang, Kai-Ming ^{[2
]}

Li, Jian-Chen ^{[1
]}

Yu, Ting-Yang ^{[1
]}

Yang, Yu-Tao ^{[1
]}

Hu, Han-Wen ^{[1
]}

Liu, Yu-Wei ^{[1
]}

Ko, Cheng-Ta ^{[2
]}

Chen, Yu-Hua ^{[2
]}

Tseng, Tzyy-Jang ^{[2
]}

Chen, Kuan-Neng ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Hsinchu 300, Taiwan

[2] Unimicron Technol Corp, NBD, Hsinchu 304, Taiwan

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2020年 / 10卷 / 08期

关键词：

3-D integration; low-temperature bonding; TECHNOLOGY;

D O I：

10.1109/TCPMT.2020.3004969

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

With the advantage of high surface-roughness tolerance, the pillar-concave Cu-Cu direct bonding without chemical-mechanical planarization (CMP) is investigated in detail, including the mechanism of thermal compensation, analysis of roughness, bonding strength, and bonding reliability. With the special design of Cu bond structure, excellent bonding results can be achieved under low thermal budget (150 degrees C for 1 min, atmosphere) with even high roughness of bonding surface. In addition, the pillar-concave scheme applied to fan-out panel-level package (FOPLP) has been demonstrated, showing the high feasibility of this scheme to realize applications in heterogeneous integration.

引用

页码：1296 / 1303

页数：8

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