Fast thermal analysis for VLSI circuits via semi-analytical Green's function in multi-layer materials

被引：0
|
作者：
Wang, BH [1 ]
Mazumder, P [1 ]
机构：
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
来源：
2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 2, PROCEEDINGS | 2004年
关键词：
D O I：
暂无
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
In this paper, a novel thermal analysis method for VLSI circuits based on the Green's function of heat conduction problem is proposed. With the method the temperature distribution can be very efficiently evaluated for the simulated chip via the proposed semi-analytical Green's function technique, by which the Green's function can be calculated online using the Green's function library obtained by inexpensive pre-characterization for the given chip structure. Experimental results validate the accuracy of the semi-analytical Green's function and demonstrate the efficiency of the thermal analysis method. Our thermal analysis approach can well adapt to the situation of thermal simulation for chips with multilayer heterogeneous heat conduction materials.
引用
收藏
页码：409 / 412
页数：4
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