High-speed I/O Buffer Modeling for Signal-integrity-based Design of VLSI Interconnects

被引:0
|
作者
Cao, Yi [1 ]
Zhang, Qi-Jun [1 ]
机构
[1] Carleton Univ, Dept Elect, Ottawa, ON K1S 5B6, Canada
关键词
PARAMETRIC MACROMODELS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Digital I/O buffers play an important role for the signal integrity (SI) simulation and timing analysis of high-speed VLSI interconnect networks, which often require the consideration of electromagnetic (EM) effects. In this paper, we give an overview of the recent advances in efficient macromodeling of nonlinear digital I/O buffers, including equivalent-circuit-based and neural-network-based approaches. The detailed equivalent circuit models axe accurate but computationally slow. On the other hand, the simplified equivalent circuit models are fast but only provide limited accuracy. The neural-network-based models axe good alternatives to those equivalent-circuit-based models, maintaining a good overall performance in terms of accuracy and speed. We demonstrate the neural-network-based approaches through an example of modeling a commercial high-speed integrated circuit (IC) device and its application to the SI simulation of high-speed interconnect networks.
引用
收藏
页码:1383 / 1386
页数:4
相关论文
共 50 条
  • [21] Sparsity Constrained Regression For High-Speed Signal Integrity Modeling
    Zhuo, Jiacheng
    He, Jiayi
    Kiguradze, Zurab
    Mutnury, Bhyrav
    Drewniak, James
    2019 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS 2019), 2019,
  • [22] Signal integrity: Fault modeling and testing in high-speed SoCs
    Nourani, M
    Attarha, A
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2002, 18 (4-5): : 539 - 554
  • [23] I/O-BUFFER MODELING SPEC SIMPLIFIES SIMULATION FOR HIGH-SPEED SYSTEMS
    DUEHREN, D
    HOBBS, W
    MURANYI, A
    ROSENBAUM, R
    EDN, 1995, 40 (06) : 65 - &
  • [24] Robust Design of High-Speed Interconnects Based on an MWCNT
    Lamberti, Patrizia
    Sarto, Maria Sabrina
    Tucci, Vincenzo
    Tamburrano, Alessio
    IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2012, 11 (04) : 799 - 807
  • [25] Experimental characterization and modeling of transmission line effects for high-speed VLSI circuit interconnects
    Jin, W
    Yoon, S
    Eo, Y
    Kim, J
    IEICE TRANSACTIONS ON ELECTRONICS, 2000, E83C (05): : 728 - 735
  • [26] Buffer for High Performance in CNT Based VLSI Interconnects
    Karthikeyan, A.
    Mallick, P. S.
    ADVANCED SCIENCE LETTERS, 2018, 24 (08) : 5975 - 5981
  • [27] Signal Integrity Analysis of High-Speed Interconnects by Using Nonconformal Domain Decomposition Method
    Shao, Yang
    Peng, Zhen
    Lee, Jin-Fa
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (01): : 122 - 130
  • [28] High speed I/O buffer design for MCM
    Yang, SJ
    Chang, TC
    Chien, RW
    Wang, ED
    Gabara, TJ
    Tai, KL
    Frye, RC
    1997 IEEE MULTI-CHIP MODULE CONFERENCE - PROCEEDINGS, 1997, : 52 - 57
  • [29] Surrogate Modeling of High-Speed Links Based on GNN and RNN for Signal Integrity Applications
    Li, Zheng
    Li, Xiao-Chun
    Wu, Ze-Ming
    Zhu, Yu
    Mao, Jun-Fa
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2023, 71 (09) : 3784 - 3796
  • [30] High-speed and low-power repeater for VLSI interconnects
    A.Karthikeyan
    P.S.Mallick
    Journal of Semiconductors, 2017, 38 (10) : 83 - 87