Random Work Function Induced DC Characteristic Fluctuation in 16-nm High-κ/Metal Gate Bulk and SOI FinFETs

被引:0
作者
Su, Hsin-Wen [1 ]
Chen, Yu-Yu [1 ]
Chen, Chieh-Yang [1 ]
Cheng, Hui-Wen [1 ]
Chang, Han-Tung [1 ]
Li, Yiming [1 ]
机构
[1] Natl Chiao Tung Univ, Dept Elect & Comp Engn, Parallel & Sci Comp Lab, 1001 Ta Hsueh Rd, Hsinchu 300, Taiwan
来源
NANOTECHNOLOGY 2012, VOL 2: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONAL | 2012年
关键词
metal gate; random work function; bulk / SOI FinFET; characteristic fluctuation; 3D device simulation; METAL; DEVICES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work studies the metal gate's work function fluctuation induced DC characteristic fluctuation in the 16-nm bulk and silicon-on-insulator (SOI) fm-type field effect transistor (FinFET) devices using an experimentally calibrated 3D device simulation. The method of localized work function fluctuation simulation enables us to estimate local fluctuations including the nanosized grain's random effects of FinFET with TiN/HfO2 gate stacks. The result of this study shows characteristic fluctuation strongly depends upon the size of localized nanosized metal grains. The shape of grains does have marginal influence on device's variability.
引用
收藏
页码:31 / 34
页数:4
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