Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition

被引：169

作者：

Daubert, James S. ^{[1
]}

Hill, Grant T. ^{[1
]}

Gotsch, Hannah N. ^{[1
]}

Gremaud, Antoine P. ^{[1
]}

Ovental, Jennifer S. ^{[1
]}

Williams, Philip S. ^{[1
]}

Oldham, Christopher J. ^{[1
]}

Parsons, Gregory N. ^{[1
]}

机构：

[1] North Carolina State Univ, Dept Chem & Biomol Engn, Raleigh, NC 27695 USA

来源：

ACS APPLIED MATERIALS & INTERFACES | 2017年 / 9卷 / 04期

关键词：

ALD; corrosion protection; copper; EIS; LSV; CHEMICAL-VAPOR-DEPOSITION; FLUIDIZED-BED REACTORS; THIN-FILMS; ALUMINA COATINGS; STAINLESS-STEEL; AQUEOUS-SOLUTIONS; ALD ALUMINA; OXIDE-FILMS; WATER; RESISTANCE;

D O I：

10.1021/acsami.6b13571

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of Al2O3, TiO2, ZnO, HfO2, and ZrO2 were deposited on copper metal using ALD, and their corrosion protection properties were measured using electrochemical impedance spectroscopy (EIS) and linear sweep voltammetry (LSV). Analysis of similar to 50 nm thick films of each metal oxide demonstrated low electrochemical porosity and provided enhanced corrosion protection from aqueous NaCl solution. The surface pretreatment and roughness was found to affect the extent of the corrosion protection. Films of Al2O3 or HfO2 provided the highest level of initial corrosion protection, but films of HfO2 exhibited the best coating quality after extended exposure. This is the first reported instance of using ultrathin films of HfO2 or ZrO2 produced with ALD for corrosion protection, and both are promising materials for corrosion protection.

引用

页码：4192 / 4201

页数：10

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