The hybrid pixel sensors and read-out electronics

被引:4
作者
Navickas, R. [1 ]
Barzdenas, V. [1 ]
机构
[1] Vilnius Gediminas Tech Univ, Elect Fac, Dept Comp Engn, LT-03227 Vilnius, Lithuania
来源
MECHATRONIC SYSTEMS AND MATERIALS | 2006年 / 113卷
关键词
X-ray; hybrid pixel sensors; charge sensitive amplifier (CSA); readout integrated circuit (ROIC); flip-chip method;
D O I
10.4028/www.scientific.net/SSP.113.453
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Hybrid pixel sensors (detectors) have shown to be a valid alternative to other types of Xray imaging devices due to their high sensitivity, linear behavior and wide dynamic range, and low noise. One important feature of these devices is the fact that detectors and readout electronics are manufactured separately. The charge created by the interaction of X-ray photons in the sensor is very small and has to be amplified in a low-noise circuit before any further signal processing. The signal induced on the electrodes of the sensor is transferred to the readout chip, where it is integrated in a charge sensitive amplifier. The issue reviews on physical principles of operation and design of the hybrid pixel sensors developed on the basis of the silicon CMOS and GaAs MESFET-technologies. The authors have designed GaAs charge sensitive amplifiers for hybrid pixel detectors and show the results of a simulation.
引用
收藏
页码:453 / 458
页数:6
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