Study on Mechanical Properties for Epoxy Resin by Molecular Dynamics

被引：0

作者：

Onodera, M. ^{[1
]}

Okabe, T. ^{[1
]}

Hasimoto, M. ^{[2
]}

Yoshioka, K. ^{[2
]}

机构：

[1] Tohoku Univ, Dept Aerosp Engn, Aoba Ku, 6-6-01 Aoba Yama, Sendai, Miyagi 9808579, Japan

[2] Toray Composites America Inc, Tacoma, WA 98446 USA

来源：

PROCEEDINGS OF THE AMERICAN SOCIETY FOR COMPOSITES | 2013年

关键词：

THERMOSET POLYMER;

D O I：

暂无

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

We investigated curing characteristics and mechanical properties of Epoxy systems by experimentation and numerical simulation. We proposed a new curing simulation based on MD simulations considering detailed reactivity mechanisms, and we also investigated mechanical properties of epoxy resin using MD simulations. In order to validate the simulation results, we utilized differential scanning calorimetry (DSC) measurements for evaluating the curing process experimentally and conducted the compression and tensile tests to assess mechanical properties.

引用

页数：12

共 5 条

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