Improvement of measuring accuracy of spatial fringe analysis method using only two speckle patterns in electronic speckle pattern interferometry

被引:19
|
作者
Arai, Yasuhiko [1 ]
机构
[1] Kansai Univ, Dept Mech Engn, Fac Engn Sci, Suita, Osaka 5648680, Japan
关键词
speckle interferometry; high-resolution deformation measurement; electronic speckle pattern interferometry; Fourier analysis; two speckle patterns; INPLANE DISPLACEMENT MEASUREMENT; DIGITAL HOLOGRAPHY; PHASE GRADIENTS; DEFORMATION; INTENSITY; ESPI;
D O I
10.1117/1.OE.53.3.034107
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
High-resolution deformation measurement method, which requires only two speckle patterns in electronic speckle pattern interferometry, is proposed by using fringe analysis based on specklegram. In fringe analysis using the proposed optical system, a pair of real-and imaginary-part components concerning the deformation information is extracted from one speckle pattern by Fourier transform in the same manner as the off-axis digital holography processing. A specklegram is calculated as a fringe image by multiplying the components of the real and imaginary part of speckle patterns in order to perform a high-resolution deformation analysis. Then, the phase map concerning deformation is detected from the specklegram, and the influence of speckle noise is also reduced by shifting the component on frequency domain. Furthermore, the amplitude of the intensity distribution of speckle pattern is normalized in order to reduce the influence by speckle noise much more. It is confirmed that the accuracy of the deformation measurement is efficiently improved by the proposed noise reduction methods. (C) The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.
引用
收藏
页数:7
相关论文
共 50 条
  • [41] Crack detection in photovoltaic cells using electronic speckle pattern interferometry
    Wen, Tzu-Kuei
    Yin, Ching-Chung
    FOURTH INTERNATIONAL CONFERENCE ON EXPERIMENTAL MECHANICS, 2010, 7522
  • [42] Hooke's law experiment using an electronic speckle pattern interferometry
    Park, Jeongwoo
    Huh, Jaehyuk
    EUROPEAN JOURNAL OF PHYSICS, 2020, 41 (06)
  • [43] Measurement of deformation of wood joints using electronic speckle pattern interferometry
    Umezaki, E
    Suzuki, T
    Takahashi, M
    JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 2004, 47 (03) : 274 - 279
  • [44] Improvement of measuring accuracy of spatial fringe analysis method using a Kalman filter and its application
    Arai, Y
    Yokozeki, S
    OPTICAL ENGINEERING, 2001, 40 (11) : 2605 - 2611
  • [45] Measurement of deformation of paper subjected to tensile loads using electronic speckle pattern interferometry
    Umezaki, E
    Takakuwa, J
    Futase, K
    SPECKLE METROLOGY 2003, PROCEEDINGS, 2003, 4933 : 360 - 365
  • [46] Experimental study on nonlinear vibrating of aluminum foam using electronic speckle pattern interferometry
    Yang, Fujun
    Ma, Yinhang
    Tao, Nan
    He, Xiaoyuan
    FIFTH INTERNATIONAL CONFERENCE ON OPTICAL AND PHOTONICS ENGINEERING, 2017, 10449
  • [47] Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
    Sim, CN
    Tay, CJ
    Cheng, L
    Third International Conference on Experimental Mechanics and Third Conference of the Asian-Committee-on-Experimental-Mechanics, Pts 1and 2, 2005, 5852 : 938 - 944
  • [48] Detection of cracks and defects using electronic speckle pattern interferometry with a holographic optical element
    Mihaylova, E
    Toal, V
    Guntaka, S
    Martin, S
    12TH INTERNATIONAL SCHOOL ON QUANTUM ELECTRONICS: LASER PHYSICS AND APPLICATIONS, 2003, 5226 : 209 - 213
  • [49] Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators
    Laskin, G.
    Heider, J.
    Schnetzler, R.
    Fratz, M.
    Schiller, A.
    Bertz, A.
    Laufenberg, M.
    Carl, D.
    UNCONVENTIONAL OPTICAL IMAGING III, 2022, 12136
  • [50] Deformation measurement of wood subjected to shearing loads using electronic speckle pattern interferometry
    Umezaki, E
    Suzuki, T
    ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2, 2004, 261-263 : 1659 - 1664