SOI-based, High Reliable Pressure Sensor with Floating Concept for High Temperature Applications

被引:23
作者
Giuliani, Andrea [1 ]
Drera, Lionello [1 ]
Arancio, Domenico [1 ]
Mukhopadhyay, Biswaijit [2 ]
Ngo, Ha-Duong [2 ]
机构
[1] Gefran SpA, Sensors Div, Brescia, Italy
[2] Tech Univ Berlin, Ctr Microperipher Technol, Berlin, Germany
来源
28TH EUROPEAN CONFERENCE ON SOLID-STATE TRANSDUCERS (EUROSENSORS 2014) | 2014年 / 87卷
关键词
SOI sensor; pressure sensor; high temperature sensor; plastixc estrusion; melt pressure; harsh environment; plastic molding; fluid free sensor; EN; 13849-1; sensor;
D O I
10.1016/j.proeng.2014.11.639
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this paper we present a high reliable, accurate and safe, solid state pressure sensor for high temperature applications. The sensor is based on an unique fluid-free technology using a piezoresistive SOI-based chip enclosed in a sealed metal housing. The proprietary housing concept allows a complete separation of the SOI-chip from the measured media. A thick steel membrane and an elongated member (push-rod) transfer the outside pressure into a small deflection of a silicon membrane on the SOI-chip. The thin silicon membrane is engraved by DRIE (Deep Reactive Ion Etching). The sensor is capable to measure pressures up to 1000 bar at temperature up to 400 degrees C with an accuracy of +/- 0,50 %FSO. A digital correction enables a compensation of Offset and Sensitivity thermal drifts. The sensor can undergo long-term extreme working conditions without losing its performances. (C) 2014 Published by Elsevier Ltd.
引用
收藏
页码:720 / 723
页数:4
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