Recent developments in deca-nanometer vertical MOSFETs

We report simulations and experimental work relating to innovations in the area of ultra short channel vertical transistors. The use of dielectric pockets can mitigate short channel effects of charge sharing and bulk punch-through; thickened oxide regions can minimize parasitic overlap capacitance in source and drain; a narrow band gap, SiGe source can reduce considerably the gain of the parasitic bipolar transistor which is particularly severe in vertical MOSFETs. The work is put into the context of the ITRS roadmap and it is demonstrated that vertical transistors can provide high performance at relaxed lithographic constraints. (C) 2004 Elsevier B.V. All rights reserved.