An optimised dynamic bottleneck dispatching policy for semiconductor wafer fabrication

被引:13
|
作者
Zhang, Huai [1 ]
Jiang, Zhibin [1 ]
Guo, Chengtao [1 ]
机构
[1] Shanghai Jiao Tong Univ, Dept Ind Engn & Management, Shanghai 200240, Peoples R China
基金
中国国家自然科学基金;
关键词
dynamic bottleneck dispatching (DBD); semiconductor wafer fabrication system (SWFS); response surface methodology (RSM); simulation optimisation; PERFORMANCE EVALUATION; PETRI-NET; SIMULATION; DESIGN;
D O I
10.1080/00207540701805638
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A dynamic bottleneck dispatching (DBD) policy is designed in this paper to detect bottlenecks in a timely way and make adaptive dispatching decisions of semiconductor wafer fabrication systems according to the real-time conditions. Control parameters of the proposed DBD algorithm are optimised by response surface methodology (RSM) and desirability functions. Numerical results show that DBD outperforms common scheduling rules such as CR + FIFO, EDD, SRPT, SPT, SPNB and an existing dynamic bottleneck dispatching method.
引用
收藏
页码:3333 / 3343
页数:11
相关论文
共 50 条
  • [1] A BOTTLENECK DETECTION AND DYNAMIC DISPATCHING STRATEGY FOR SEMICONDUCTOR WAFER FABRICATION FACILITIES
    Zhou, Zhugen
    Rose, Oliver
    PROCEEDINGS OF THE 2009 WINTER SIMULATION CONFERENCE (WSC 2009 ), VOL 1-4, 2009, : 1613 - 1623
  • [2] An approach of dynamic bottleneck machine dispatching for semiconductor wafer fab
    Huai, Zhang
    Jiang Zhibin
    Lee Yen-Fei
    Ko Chen-Pin
    Tuck, Luke Choo Ooi
    Phing, Lim Lee
    ISSM 2007: 2007 INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2007, : 253 - +
  • [3] A Greedy Dynamic Priority Dispatching Policy for Intrabay in Semiconductor Wafer Fabrication System
    Wu, Lihui
    Zhang, Jie
    Sun, Yinbin
    Zhang, Gong
    PROCEEDINGS OF THE 6TH CIRP-SPONSORED INTERNATIONAL CONFERENCE ON DIGITAL ENTERPRISE TECHNOLOGY, 2010, 66 : 927 - 938
  • [4] Bottleneck-oriented dispatching strategy and parameter optimization in semiconductor wafer fabrication system
    Dept. of Industrial Eng. and Management, Shanghai Jiaotong Univ., Shanghai 200240, China
    Shanghai Jiaotong Daxue Xuebao, 2007, 8 (1252-1257):
  • [5] A mixed dispatching rule for semiconductor wafer fabrication
    Huang, Yeu-Shiang
    Chen, Hung-Wen
    INTERNATIONAL JOURNAL OF SYSTEMS SCIENCE-OPERATIONS & LOGISTICS, 2018, 5 (03) : 195 - 203
  • [6] Objective-driven dynamic dispatching rule for semiconductor wafer fabrication facilities
    Jia, Peng-De
    Wu, Qi-Di
    Li, Li
    Jia, Peng-De, 1600, CIMS (20): : 2808 - 2813
  • [7] AN ANALYSIS OF DISPATCHING RULES IN A SEMICONDUCTOR WAFER FABRICATION ENVIRONMENT
    MCCUTCHEN, T
    LEE, CL
    JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (03): : 165 - 174
  • [8] Adaptive Dispatching Rule for Semiconductor Wafer Fabrication Facility
    Li, Li
    Sun, Zijin
    Zhou, MengChu
    Qiao, Fei
    IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2013, 10 (02) : 354 - 364
  • [9] Value-based dispatching for semiconductor wafer fabrication
    Pierce, NG
    Yurtsever, T
    2000 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, 2000, : 245 - 249
  • [10] PRACTICAL ISSUES IN SCHEDULING AND DISPATCHING IN SEMICONDUCTOR WAFER FABRICATION
    JOHRI, PK
    JOURNAL OF MANUFACTURING SYSTEMS, 1993, 12 (06) : 474 - 485