Thermal stability of Cu and Fe nitrides and their applications for writing locally spin valves

被引:32
作者
Navio, C. [1 ]
Alvarez, J. [1 ]
Capitan, M. J. [2 ]
Camarero, J. [3 ]
Miranda, R. [1 ,3 ]
机构
[1] Univ Autonoma Madrid, Dpto Fis Mat Condensada, E-28049 Madrid, Spain
[2] CSIC, Inst Estructura Mat, E-28006 Madrid, Spain
[3] Inst Madrileno Estudios Avanzados Nanociencia IMD, Madrid, Spain
关键词
annealing; copper compounds; ferromagnetic materials; iron compounds; laser beam effects; magnetic multilayers; nanostructured materials; semiconductor epitaxial layers; semiconductor-metal boundaries; spin valves; thermal stability; thin films; IRON NITRIDES; THIN-FILM; COPPER; GAS; MAGNETORESISTANCE; TEMPERATURE; CU(100); SURFACE; GROWTH;
D O I
10.1063/1.3159630
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have studied the thermal stability of the Cu and Fe nitrides. These results show that a nanometer-thick Cu nitride film decomposes at the Fe(4)N growth temperature. Considering this, we propose for their use in spintronics, the room temperature growth of a nonmagnetic (FeN)/semiconducting (Cu(3)N) epitaxial nitride bilayer that transforms into a ferromagnetic (Fe(4)N)/metallic (Cu) one by mild thermal annealing at 700 K. This process can be employed to locally decompose by laser (or ion) irradiation FeN/Cu(3)N/Fe(4)N) trilayers, giving rise to an array of lithographically defined Fe(4)N/Cu/Fe(4)N spin valves surrounded by metal/semiconductor spacers.
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页数:3
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