Twin nucleation at triple junction during hot deformation of copper polycrystal

被引:7
作者
Miura, H [1 ]
Hamaji, H [1 ]
Sakai, T [1 ]
机构
[1] Univ Electrocommun, Dept Mech Engn & Intelligent Machines, Chofu, Tokyo 1828585, Japan
来源
TEXTURES OF MATERIALS, PTS 1 AND 2 | 2002年 / 408-4卷
关键词
copper; dynamic recrystallization; grain-boundary sliding; nucleation; SEM-EBSP; triple junctions; twin;
D O I
10.4028/www.scientific.net/MSF.408-412.755
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Dynamic recrystallization (DRX) in copper polycrystal was investigated in compression at 873 K and at a true strain rate of 2.9 x 10(-4) s(-1). The peak strain in the flow curve, where DRX macroscopically and frequently started to take place, was about 0.08. However, DRX had already started preferentially and locally at the triple junctions (TJs) at much lower strains from 0.02 to 0.04. The number of the DRX nucleation at the TJ increased linearly with increasing strain. At a strain of = 0.04, DRX took place at about 40% of the TJs. However, DRX nucleation seemed to be difficult when TJ was composed of twin boundary. It was also notable that most of the nucleated grains at the TJs kept twin ( 3) relation with one of the grains composing the TJs. This should be suggestive of the origin of the DRX grain. The DRX nucleation at the TJ and twin formation will be discussed in relation with grain-boundary sliding, grain-boundary migration, misorientation angle and etc.
引用
收藏
页码:755 / 760
页数:6
相关论文
共 50 条
[21]   Hot deformation behavior of KFC copper alloy during compression at elevated temperatures [J].
张辉 ;
张红钢 ;
彭大暑 .
Transactions of Nonferrous Metals Society of China, 2006, (03) :562-566
[22]   Nucleation and texture development during dynamic recrystallization of copper [J].
McDonald, DT ;
Humphreys, FJ ;
Bate, PS .
ICOTOM 14: TEXTURES OF MATERIALS, PTS 1AND 2, 2005, 495-497 :1195-1200
[23]   Nucleation of recrystallization in Mg alloys during and after hot working [J].
Barnett, Matthew R. ;
Beer, Aiden .
RECRYSTALLIZATION AND GRAIN GROWTH IV, 2012, 715-716 :96-+
[24]   Annealing twin development in austenite in steels after hot deformation [J].
Garcia-Chao, Pablo ;
Nyyssonen, Tuomo ;
Stahlkrantz, Adam ;
Magnusson, Hans .
MATERIALS CHARACTERIZATION, 2025, 224
[25]   Stability of iodine on ruthenium during copper electrodeposition and its effects on the nucleation behavior of electrodeposited copper [J].
Bjelkevig, Cameron ;
Kelber, Jeff .
ELECTROCHIMICA ACTA, 2009, 54 (15) :3892-3898
[26]   Effects of twin-twin interactions and deformation bands on the nucleation of recrystallization in AZ31 magnesium alloy [J].
Zhang, Kai ;
Shao, Zhutao ;
Jiang, Jun .
MATERIALS & DESIGN, 2020, 194
[27]   Effects of Cr addition on the constitutive equation and precipitated phases of copper alloy during hot deformation [J].
Ban, Yijie ;
Zhang, Yi ;
Jia, Yanlin ;
Tian, Baohong ;
Volinsky, Alex A. ;
Zhang, Xiaohui ;
Zhang, Qifei ;
Geng, Yongfeng ;
Liu, Yong ;
Li, Xu .
MATERIALS & DESIGN, 2020, 191
[28]   Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression [J].
Liu, Haitao ;
Hua, Yunxiao ;
Li, Weiqiang ;
Hou, Zhenguo ;
Dong, Jincan ;
Liu, Yong .
COATINGS, 2024, 14 (10)
[29]   Dynamic Recrystallization of 7055 Aluminum Alloy During Hot Deformation [J].
Yan, Liangming ;
Shen, Jian ;
Li, Junpeng ;
Li, Zhoubing ;
Tang, Zhenlei .
ENERGY AND ENVIRONMENT MATERIAL S, 2010, 650 :295-301
[30]   Flow behavior and microstructural evolution in nickel during hot deformation [J].
Gao, Wen-Li ;
Lai, Shi-Zhen ;
Teng, Jie ;
Du, Zhen-Tao ;
Liu, Xue-Sheng ;
Chang, Yao-Wei .
RARE METALS, 2019, 38 (07) :675-682