A Low-Cost Broadband Bondwire Interconnect for Heterogeneous System Integration

被引：0

作者：

Li, Chun-Hsing ^{[1
,2
]}

Ko, Chun-Lin ^{[1
,2
,3
]}

Kuo, Chien-Nan ^{[1
,2
]}

Kuo, Ming-Ching ^{[4
]}

Chang, Da-Chiang ^{[3
]}

机构：

[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan

[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 30039, Taiwan

[3] Natl Appl Res Labs, Natl Chip Implementat Ctr, Hsinchu, Taiwan

[4] ITRI, Informat & Commun Res Labs ICL, Hsinchu, Taiwan

来源：

2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS) | 2013年

关键词：

Broadband; interconnect; bondwire; transmission lines; heterogeneous integration;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bondwire effect can be reduced to provide an interconnect with good return loss and low insertion loss. In this work, the chip and the carrier are realized in 90-nm CMOS and GIPD process, respectively. Measured results show that the return loss and the insertion loss are better than 10 dB and 1.1 dB, respectively, from DC to 45.2 GHz.

引用

页数：4

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