Reactive wetting of TiC-Ni cermet by Ag-Cu-Zn alloy during evaporation

被引：13

作者：

Lei, M. ^{[1
]}

Feng, J. C. ^{[1
]}

Tian, X. Y. ^{[1
]}

Shi, J. M. ^{[1
]}

Zhang, L. X. ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

来源：

VACUUM | 2017年 / 138卷

基金：

中国国家自然科学基金;

关键词：

Reactive; Wetting; Evaporation; Interface; TiC-Ni cermet; CONTACT-ANGLE; MOLTEN MG; SYSTEM; METAL; LIQUIDS;

D O I：

10.1016/j.vacuum.2017.01.014

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In order to investigate the effect of the evaporation on wetting, reactive wetting of TiC-Ni cermet by molten Ag-Cu-Zn alloys with different Zn contents was studied at 810 degrees C using a sessile drop method in vacuum. The vapor recoil force induced by the strong evaporation of Zn in the Ag-Cu-25Zn alloy drove the spreading of the molten Ag-Cu-25Zn alloy. Furthermore, the sequential evaporation of Zn in the AgCu-25Zn alloy caused the formation of a (Cu, Ni) solid-solution layer at the interface between the TiC-Ni cermet and the Ag-Cu-Zn alloy. Thus, the (Cu, Ni) solid-solution layer could serve as a metallization layer on the surface of the TiC-Ni cermet, which promoted the non-wetting to wetting transition of the TiC-Ni cermet by the Ag-Cu-25Zn alloy. The equilibrium contact angle of the Ag-Cu-25Zn alloy on the TiC-Ni cermet was 19.9, approximately equal to that of a Ag-28Cu eutectic alloy on a Cu-Ni alloy surface. The final contact angle of the Ag-Cu-Zn liquid alloy on the TiC-Ni cermet first decreased and then increased as the Zn content in the liquid was increased from 0% to 30%. It reached a minimum value in the Ag-Cu-25Zn alloy. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：22 / 29

页数：8