Excimer laser micromachining for 3D microstructure

被引:26
作者
Choi, KH [1 ]
Meijer, J
Masuzawa, T
Kim, DH
机构
[1] Jeju Natl Univ, Sch Mech Engn, Jeju, South Korea
[2] Univ Twente, NL-7500 AE Enschede, Netherlands
[3] Univ Tokyo, Inst Ind Sci, Minato Ku, Tokyo 106, Japan
关键词
3D micromachining technology; excimer laser; laser ablation; hole area modulation; MEMS;
D O I
10.1016/j.jmatprotec.2004.03.005
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A new 3D micromachining method, called Hole Area Modulation (HAM), has been introduced to enhance the current micromachining technology. In this method, information on the machining depth is converted to the sizes of holes on the mask. The machining is carried out with a simple 2D movement of the workpiece or the mask. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a mathematical model for excimer laser micromachining based on HAM and determination of the optimal laser ablation conditions (hole diameter, step size, mask movement velocity, etc.) are described. The simulation and experiment of the HAM-based laser ablation were carried out successfully to create microlens. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:561 / 566
页数:6
相关论文
共 10 条
  • [1] BANG SY, 2000, P 2 KOR MEMS C, P15
  • [2] A COMPUTER-SIMULATION METHOD FOR STUDYING THE ABLATION OF POLYMER SURFACES BY ULTRAVIOLET-LASER RADIATION
    GAI, HD
    VOTH, GA
    [J]. JOURNAL OF APPLIED PHYSICS, 1992, 71 (03) : 1415 - 1420
  • [3] Galantucci LM, 1998, CIRP ANNALS 1998 - MANUFACTURING TECHNOLOGY, VOL 47, NO 1, V47, P141
  • [4] GROWER MC, 1998, P SPIE HIGH POW LAS, V3343, P171
  • [5] GROWER MC, 1999, P SPIE LASER APPL 4, V3618, P251
  • [6] MASUZAWA T, 2002, P 3 EUSP INT C, P395
  • [7] Laser machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons
    Meijer, J
    Du, K
    Gillner, A
    Hoffmann, D
    Kovalenko, VS
    Masuzawa, T
    Ostendorf, A
    Poprawe, R
    Schulz, W
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2002, 51 (02) : 531 - 550
  • [8] RUMSBY PT, 1996, P SOC PHOTO-OPT INS, V2921, P684
  • [9] Tonshoff HK, 1997, LASER MATERIALS PROCESSING CONFERENCE, PTS 1 & 2, pA114
  • [10] Simulation study and experiment on laser-ablation surface cleaning
    Zhou, X
    Imasaki, K
    Furukawa, H
    Umino, H
    Sakagishi, K
    Nakai, S
    Yamanaka, C
    [J]. OPTICS AND LASER TECHNOLOGY, 2001, 33 (03) : 189 - 194