Microwave Characteristic of SiON Thin Film Surface Passivation on Low Resistivity Silicon Wafer

被引:0
作者
Wang, Sin-Pei [1 ]
Tai, Tzu-Chun [2 ]
Lin, Jia-Hao [3 ]
Hung, Cheng-Yuan [4 ]
Wu, Hung-Wei [1 ]
Wang, Yeong-Her [2 ,5 ]
Liu, Shih-Kun [3 ]
机构
[1] Kun Shan Univ, Dept Comp & Commun, Tainan, Taiwan
[2] Natl Cheng Kung Univ, Dept Photon, Tainan, Taiwan
[3] Natl Kaohsiung Univ Sci & Technol, Dept Elect Engn, Kaohsiung, Taiwan
[4] Natl Cheng Kung Univ, Met Ind Res & Dev Ctr, Med Devices & Optoelect Equipment Dept, Tainan, Taiwan
[5] Natl Cheng Kung Univ, Adv Optoelect Technol Ctr, Inst Microelect, Dept Elect Engn, Tainan, Taiwan
来源
PROCEEDINGS OF 4TH IEEE INTERNATIONAL CONFERENCE ON APPLIED SYSTEM INNOVATION 2018 ( IEEE ICASI 2018 ) | 2018年
关键词
FG-CPW; surface passivatoin; PECVD; SiON; POWER-HANDLING CAPABILITY; MICROSTRIP LINES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study presents the amorphous silicon-oxy-nitride (SiON) thin film surface passivation layer depositing by very high frequency plasma-enhanced chemical vapor deposition (VHF PECVD) for applying on the application of surface passivation on standard low-resistivity silicon (LR-Si) substrate. The finite-ground coplanar waveguide (FG-CPW) line is fabricated on the SiON/LR-Si structure for investigating the microwave properties. The proposed finite-ground coplanar waveguide line is measured by accurate microwave on-wafer analysis platform up to 60 GHz. The surface passivation layer can improve microwave attenuation of the FG-CPW line. This method can be applied in radio frequency integrated circuit (RFIC).
引用
收藏
页码:1125 / 1128
页数:4
相关论文
共 11 条
  • [1] AVERAGE POWER-HANDLING CAPABILITY OF MICROSTRIP LINES
    BAHL, IJ
    GUPTA, KC
    [J]. IEE JOURNAL ON MICROWAVES OPTICS AND ACOUSTICS, 1979, 3 (01): : 1 - 4
  • [2] Average power handling capability of multilayer microstrip lines
    Bahl, IJ
    [J]. INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2001, 11 (06) : 385 - 395
  • [3] Baliga J., 2004, SEMICOND INT, V27, P32
  • [4] Chen C. J., 2011, IEEE ELECT DEVICE LE, V32
  • [5] Kim H. K., 2012, SPRINGEROPENOPEN J N
  • [6] Leung Lydia. L. W., 2004, IEEE T COMPONENTS PA, V27
  • [7] Characterization of silver CPWs for applications in silicon MMICs
    Levenets, VV
    Amaya, RE
    Tarr, NG
    Smy, TJ
    Rogers, JWM
    [J]. IEEE ELECTRON DEVICE LETTERS, 2005, 26 (06) : 357 - 359
  • [8] Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects
    Ponchak, GE
    Margomenos, A
    Katehi, LPB
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (05) : 866 - 870
  • [9] Pozar D. M., MICROWAVE ENG, V4th
  • [10] PECVD based silicon oxynitride thin films for nano photonic on chip interconnects applications
    Sharma, Satinder K.
    Barthwal, Sumit
    Singh, Vikram
    Kumar, Anuj
    Dwivedi, Prabhat K.
    Prasad, B.
    Kumar, Dinesh
    [J]. MICRON, 2013, 44 : 339 - 346