共 38 条
[2]
Blazej D., 2003, Electronics Cooling, V9, P14
[3]
Booth R. B., 1992, U.S. Patent, Patent No. [5.198.189, 5198189]
[7]
Cola B.A., 2010, ELECTRONICSCOOLING, V16, P10
[8]
Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device
[J].
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,
2009, 95 (03)
:907-915
[10]
Evans D. S., 1978, Metal Science, V12, P411