Characteristics of lead-free solders during flow soldering - (Selective and wave soldering)

被引：0

作者：

Pape, Uwe ^{[1
]}

Schulz, Jens-Uwe ^{[1
]}

机构：

[1] Fraunhofer Inst Reliabil & Microintegrat, Gustav Meyer Allee 25, D-13355 Berlin, Germany

来源：

ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The use of lead-free solders requires new fundamental information for flow soldering. Parameters, approved for many years with the solder SnPb, for wave height, flow speed and also the tear-off-angle must be defined again for lead-free solders. In addition, the corrosion of substrate metallization and especially of machines (crucible and other parts in liquid solder) is under discussion for lead-free soldering today. A new combined measurement method for analyzing the characteristics of new solder in a relatively short time was developed at IZM. Therefore, the surface energy as a value for tear-off behavior, the viscosity as a value for the flow behavior and also the corrosion rate were measured. A comparison between different solders or solder alloys provides the solder manufacturers as well as the solder machine manufacturer with important data for the application and further development of new technologies.

引用

页码：139 / +

页数：2