Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites

被引:89
作者
Wang, Luhua [1 ,2 ]
Li, Jianwei [1 ,3 ]
Che, Zifan [1 ,2 ]
Wang, Xitao [1 ]
Zhang, Hailong [1 ]
Wang, Jinguo [2 ]
Kim, Moon J. [2 ]
机构
[1] Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China
[2] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA
[3] Jiangsu Univ, Inst Adv Mfg & Modern Equipment Technol, Zhenjiang 212013, Peoples R China
基金
中国国家自然科学基金;
关键词
Metal matrix composites (MMCs); Interfacial structure; Thermal conductivity; Scanning transmission electron microscopy; GAS-PRESSURE INFILTRATION; HEAT SINK APPLICATIONS; INTERFACIAL MICROSTRUCTURE; COATED DIAMOND; COPPER/DIAMOND COMPOSITES; CU/DIAMOND COMPOSITES; MANAGEMENT MATERIALS; POWDER-METALLURGY; CARBIDE LAYER; OPTIMIZATION;
D O I
10.1016/j.jallcom.2018.03.241
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Weak interface bonding inhibits high thermal conductive potential of diamonds in metal matrix composites reinforced with diamond particles (Cu/diamond composites). With an attempt to modify the Cu/diamond interface, we combine Cr pre-coating and Cr alloying to produce Cu-Cr/Cr-diamond composites by gas pressure infiltration. High resolution transmission electron microscopy (HRTEM) results reveal that Cr pre-coating on the diamond surface before infiltration promotes the formation of highly active graphite-like structures. These structures enhance the interfacial reaction and intensify the formation of a uniform and dense carbide layer on the diamond surface. By altering the Cr concentration in the Cu-Cr alloy matrix, the thickness of interfacial carbide layer is tailored. As a result, a maximum thermal conductivity of 810Wm(-1) K-1 is achieved in the Cu-0.5 wt% Cr/Cr-diamond composite, which is the highest value among Cr-modified Cu/diamond composites reported so far. The high thermal conductivity is attributed to optimal interface conditions: moderate thickness of interfacial carbide layer, uniform and dense carbide layer on the diamond surface, and crystallographically aligned interfacial graphite layers. This study offers a new route to modifying interface bonding and to enhancing thermal conductivity of Cu/diamond composites. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:1098 / 1105
页数:8
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