Application of ALD high-k Dielectric Films as Charge Storage Layer and Blocking Oxide in Nonvolatile Memories

被引:0
|
作者
Zhu, Xiaoxiao [1 ,2 ]
Gu, Diefeng [3 ,4 ]
Li, Qiliang [1 ,2 ]
Baumgart, H. [3 ]
Ioannou, D. E. [1 ,2 ,4 ]
Suehle, J. S. [1 ,2 ]
Richter, C. A. [1 ,2 ]
机构
[1] George Mason Univ, Dept Elect Engn & Comp Engn, Fairfax, VA 22030 USA
[2] NIST, Div Semicond Elect, CMOS & Novel Dev Grp, Gaithersburg, MD 20899 USA
[3] Old Dominion Univ, Dept Elect Engn & Comp Engn, Norfolk, VA 23529 USA
[4] Appl Res Ctr ODU, Jefferson Lab, Newport News, VA 23606 USA
来源
PHYSICS AND TECHNOLOGY OF HIGH-K GATE DIELECTRICS 7 | 2009年 / 25卷 / 06期
关键词
HFO2;
D O I
10.1149/1.3206647
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
ALD high-k dielectric films of HfO2 were utilized for the charge trapping layer and Al2O3 for the blocking oxide layer during fabrication of several Metal/Al2O3/HfO2/SiO2/Si (MAHOS) nonvolatile memory (NVM) cells based on Si nanowire channel. Si nanowires grown from predefined Au catalysts were integrated into memory devices by using a self-aligning approach. For benchmarking and comparison a different Metal/SiO2/HfO2/SiO2/Si (MOHOS) nonvolatile memory cell with a SiO2 blocking layer was also processed. All the Si nanowire nonvolatile memory cells show a large memory window, good endurance and retention, however, the MAHOS cells with Al2O3 blocking layers outperform the MOHOS cell with SiO2 blocking layer.
引用
收藏
页码:473 / 479
页数:7
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