Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

被引：0
|
作者：
Noriki, A. [1 ,2 ]
Ukita, A. [1 ]
Takemura, K. [1 ]
Suda, S. [1 ,2 ]
Kurosu, T. [1 ,2 ]
Ibusuki, Y. [1 ]
Tamai, I [1 ]
Shimura, D. [1 ]
Onawa, Y. [1 ]
Yaegashi, H. [1 ]
Amano, T. [1 ,2 ]
机构：
[1] Photon Elect Technol Res Assoc PETRA, Tsukuba, Ibaraki, Japan
[2] Natl Inst Adv Ind Sci & Technol, Tokyo, Japan
来源：
2022 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC) | 2022年
关键词：
D O I：
暂无
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glasse-poxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB. (c) 2022 The Author(s)
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页数：4
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