TEM and XRD characterizations of epitaxial silicon layer fabricated on double layer porous silicon

被引:0
作者
Gouder, S. [1 ]
Tebessi, L. [1 ]
Mahamdi, R. [2 ]
Escoubas, S. [3 ]
Favre, L. [3 ]
Aouassa, M. [3 ]
Ronda, A. [3 ]
Berbezier, I. [3 ]
机构
[1] Univ Tebessa, Tebessa 12000, Algeria
[2] Batna 2 Univ, Dept Elect, LEA, Batna 05000, Algeria
[3] CNRS, UMR 7334, Fac Sci, Aix Marseille IM2NP, St Jerome Case 142, F-13397 Marseille 20, France
来源
DIELECTRIC MATERIALS AND APPLICATIONS, ISYDMA '2016 | 2016年 / 1卷
关键词
Double Layer; Porous Silicon; Molecular Beam Epitaxy; Transmission Electron Microscopy; High Resolution X-Ray Diffraction;
D O I
10.21741/2474-395X/1/62
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Single crystal Silicon (Si) layers have been deposited by molecular beam epitaxy on double-layer porous silicon (PSi). We show that a top thin layer with a low porosity is used as a seed layer for epitaxial growth. While, the underlying higher porosity layer is used as an easily detectable etch stop layer. The morphology and structure of epitaxial Si layer grown on the double-layer PSi are investigated by high resolution X-ray diffraction and transmission electron microscopy. The results show that, an epitaxial Si layer with a low defect density can be grown. Epitaxial growth of thin crystalline layers on double-layer PSi can provide opportunities for silicon-on-insulator applications and Si-based solar cells provided that the epitaxial layer has a sufficient crystallographic quality.
引用
收藏
页码:249 / 252
页数:4
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