Numerical assessment of liquid cooling system for power electronics in fuel cell electric vehicles

被引:26
作者
Park, Heesung [1 ]
机构
[1] Hyundai Motor Co, Div Res & Dev, Yongin 446912, South Korea
关键词
Power electronics; Liquid cooling system; CFD; Fuel cell electric vehicle; THERMAL MANAGEMENT; FLOW; PERFORMANCE; MODEL; JET;
D O I
10.1016/j.ijheatmasstransfer.2014.02.038
中图分类号
O414.1 [热力学];
学科分类号
摘要
Electrical power from the fuel cells is converted and controlled by power electronics that are composed of control units, converters and switching devices. During the power management, the inevitable power losses induce heat generation in the power electronics. In this, effective design for the cooling system is essential in terms of safety, reliability, and durability. A liquid cooling system for the power electronics is applied to chill the electrical components below the thermal specifications. Nonetheless, the layout of cooling components is usually designed after the completion of the chassis and power electronics in the automotive applications, thus, only a little freedom is allowed to change the layout. Thus, it is significant and urgent to investigate the cooling performance before finalizing the layout design. In this paper, one dimensional and computerized fluid dynamics code is employed to simulate the performance of the cooling system at the early stage of conceptual design. Three different layouts of cooling systems are chosen to compare the ensuing systematic cooling performances. The liquid flow rates, pressure drops, and maximum temperatures are computed by the numerical simulations of the cooling system which comprises the cold plates, liquid pump, radiator, and plumbing network. It is demonstrated that for a fuel cell electric vehicle of 100 kW, the dual cooling loops with a specified array control the maximum temperatures below thermal specification by inducing the higher liquid flow rate of rate of 33.4 L/min through radiator than 20.0 L/min in a single loop. The proposed systematic numerical simulation provides significant information to determine the layout of the power electronics coupled with the cooling performance at the early stage of conceptual design. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:511 / 520
页数:10
相关论文
共 38 条
  • [21] Friction factor and heat transfer in multiple microchannels with uniform flow distribution
    Park, Hee Sung
    Punch, Jeff
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (17-18) : 4535 - 4543
  • [22] A microchannel heat exchanger design for microelectronics cooling correlating the heat transfer rate in terms of Brinkman number
    Park, HeeSung
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (09): : 1373 - 1378
  • [23] Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems
    Perpina, Xavier
    Jorda, Xavier
    Vellvehi, Miquel
    Rebollo, Jose
    Mermet-Guyennet, Michel
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2011, 58 (07) : 2662 - 2672
  • [24] Pickert V., 2010, 5 IET INT C POW EL M, P19
  • [25] Numerical model of a two-phase microchannel heat sink electronics cooling system
    Saenen, Tom
    Baelmans, Martine
    [J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2012, 59 : 214 - 223
  • [26] Reliability challenges of automotive power electronics
    Scheuermann, U.
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (9-11) : 1319 - 1325
  • [27] Schutze J., 2011, IEEE T IND ELECTRON, V48, P281
  • [28] Optimal thermal operation of liquid-cooled electronic chips
    Sharma, Chander Shekhar
    Zimmermann, Severin
    Tiwari, Manish K.
    Michel, Bruno
    Poulikakos, Dimos
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (7-8) : 1957 - 1969
  • [29] Convection Heat Transfer and Flow Calculations Suitable for Electric Machines Thermal Models
    Staton, David A.
    Cavagnino, Andrea
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2008, 55 (10) : 3509 - 3516
  • [30] Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules
    Tan, S. P.
    Toh, Kok Chuan
    Khan, Navas
    Pinjala, D.
    Kripesh, V.
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04): : 536 - 544